Wearable/ Handheld with 3D Interconnection DNA
As handheld and wearable products evolve along their growth through time, demands on feature and function drive innovations of the technology being added into these consumers’ products. Conflict among multifunction, low power consumption, and thin profile become intensive and 3D interconnection becomes one of the new saviors. Through the 3D interconnections and combining the extension of packaging techniques on wafer scale, an innovative package form that provides solutions without compromising any characteristics hence derived.