3D IC and Packaging – Key for System Integration
To meet the next generation system requirements that are driven by such new applications as data center/cloud, mobility and Internet of Things (IoT), the packaging technology has to evolve along with the IC technology scaling. At the same time, design and development of packages have to meet the cost, performance, form factor and reliability goals. In this talk we will examine new advances in packaging technology to maintain the IC scaling edge, as well as the role of new 2.5D and 3D IC integration to address the gap seen between the slowdown of Moore’s law scaling and the ever increasing system integration requirements. We will also discuss the emerging component technologies and supply chain ecosystems for enabling the 3D System-in-Package (SiP) solutions for data center and networking applications.