PLP(Panel Level Package) Technology
Re-Distribution Layer technologies are new revolution to change the semiconductor package. They perform not only higher electrical characteristic but also size reduction of semiconductor package. J-DEVICES focuses on embedded die technology with PCB format. The reason why J-DEVICES
chooses PCB format is to utilize infrastructure of large panel and the same cost sense of semiconductor package material. J-DEVICES is promoting their embedded die technology under trade mark of PLP. Current panel size of PLP is 515x410mm and already finished internal qualification.
In this presentation, speaker will explain the detailed structure of PLP, package characteristic, reliability test results and finally will explain the target application using PLP technology.