ReCon® Packaging Technology for “System Integration & Portable/Wearable/IOT Devices”
This talk is about the introduction of ReCon® technology specific to the technical and cost advantages and how ReCon® technology is scalable to address the challenges that wearable/IoT products are facing. The ReCon® technology is a single-assembly infrastructure for different package types, sizes, configurations, and applications. It enables low barriers to entry compared to Fan Out with lower capital investment, lower cost with higher manufacturing efficiency and shorter cycle time. It enables thinner core and coreless substrate resulting in better thermal, electrical, mechanical performance.
It also enables silicon protection with much improved quality and reliability. It is manufacturing proven and offers unlimited integration scheme of mixing different wafer and substrate technologies resulting in smarter and more efficient IoT, wearable, and global networking solutions.