Wafer Level Fan-Out Package
A portfolio of WLSI technologies haves been innovated and developed. Those include CoWoS, InFO and UFI, for high, medium and low I/O pin-count applications. Every technology is processed in wafer form leveraging each other, as well as on-chip Cu/Low-K interconnects. InFO is shown to be a good replacement of flip-chip (PoP) and 3DIC/TSV for overall better performance, power, area and cost. Cost reduction strategy will also be addressed.