Non-Destructive Analysis Techniques for Advanced Package
Due to the demand of smaller and thinner packages with enhanced performance and function, lots R&D efforts are put on the 2.5D and 3D IC to achieve the goal.
The complexity of the structure of this advanced package makes the failure analysis a difficulty. Especially when chip function is recovered back after decapsulation of the package. In order to detailed investigation the root cause at package level, new tools with higher resolution and penetration capability are required to non-destructively tackle the failure.
Using TDR, 3D X-ray microscope, high performance SAT and Lock-in Thermography, failures resulted from package process can be clearly revealed and the root cause can be identified by following physical failure analysis.