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            <td colspan="2"><span style="font-family: Verdana;"><span style="font-size: medium;" _mce_style="font-size: medium;"><b style="font-family: Arial;" _mce_style="font-family: Arial;"><span style="color: rgb(102, 102, 102);" _mce_style="color: #666666;">Topic:</span></b></span></span><span style="font-size: medium;" _mce_style="font-size: medium;"><b style="font-family: Arial;" _mce_style="font-family: Arial;"><span style="color: rgb(102, 102, 102);" _mce_style="color: #666666;"><br />
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            <p style="margin-top: 0pt; margin-bottom: 0pt; direction: ltr; unicode-bidi: embed; vertical-align: baseline;"><strong><span style="font-size: medium;"><span style="font-family: Verdana;">Low Temperature Curabale Polyimide for Advanced Package<br />
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            <td colspan="2"><span style="font-family: Verdana;"><span style="font-size: medium;" _mce_style="font-size: medium;"><b style="font-family: Arial;" _mce_style="font-family: Arial;"><span style="color: rgb(102, 102, 102);" _mce_style="color: #666666;">Abstract:</span></b></span></span></td>
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            <p style="margin-top: 2.4pt; margin-bottom: 0pt; direction: ltr; unicode-bidi: embed; vertical-align: baseline;"><span style="font-size: medium;"><span style="font-family: Verdana;">The most important requirement for dielectric layer of advanced package is &lsquo;High reliability with low temperature cure&rsquo;. And we made the suitable products as PIMELTM BL-301. How we had designed and achieved the requirement will be discussed. <br />
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