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Topic:

The Growth of Advanced Packaging: Technology Overview, Applications and Market Trends

   
Abstract:

Computing has significantly evolved over the years in complexity, range of applications, variety of products and volumes, driving the need for more advanced and performing semiconductor devices, with increased functionality, highly integrated in smaller, thinner and lower cost packages. These trends had and continue to impact how devices are designed, manufactured and packaged, at the unit as well as system level. On the packaging side, several technologies and platforms have been developed and are available today to address the requirements across a wide range of markets and applications: from wirebonded to wafer level packages using bumping technologies, as well newer platforms with promise of further enabling higher integration, such as fan-out and 3D stacking.

This paper will provide an overview of current trends seen across the packaging platforms with the highest growth and interest in the industry: WLCSP, flip Chip, fan-Out and embedded die technologies, and 3DIC. Challenges, applications, positioning of the different packaging technologies by market segments (from low to high end applications), evolution of the markets and drivers, growth rates and roadmaps will be presented. Global demands and available capacities, landscape of the packaging industry will be reviewed. Examples of teardowns to illustrate the latest packaging technologies from lower cost (WLCSP) to more complex (3D stacked) platforms will be included.