SEMI Taiwan Homepage sctaiwan_logo_2015
   
   
Topic:

Next Generation of FEOL CMP Slurries to Meet Defectivity Needs of Sub-14nm

   
Abstract:

With the trend of the IC industry moving from planar to alternative transistor structures there continues to be more opportunities and challenges for Front End of Line CMP materials and processes.  Air Products’ advanced oxide slurries continue to be a leading offering in the silicon oxide polish space as they are capable of producing excellent planarization, low dishing, and high selectivity to various films. 

For advanced node applications, the drive for zero defectivity performance mandates continual improvements in slurry abrasives.  The main approaches to address these challenges for legacy calcined ceria abrasives include: 1) particle refinement technology for large particle count reduction and particle size distribution control and 2) modification of abrasive properties (both chemical and physical). 

Alternative abrasives, such as colloidal ceria, are being developed and evaluated for advanced node, oxide CMP applications, based on potential for ultra-low defectivity performance.  Critical to the adoption of colloidal ceria will be validation of low defectivity performance accompanied with comparable or improved removal rate, selectivity, and planarization-ability to legacy calcined abrasives.  In this presentation we will review the major technical challenges facing the IC industry, in terms of STI/oxide CMP, and Air Products’ solutions for addressing these issues and industry future needs.