SEMI Taiwan Homepage sctaiwan_logo_2015
   
   

Lewis Huang / 黃智堯

Deputy General Manager

Senju Metal Industry Co., ltd

Taiwan Branch 
   
Education:  
• KUAS - IE&M
• NCKU - IMBA
   
Experiences:  
• Senju Metal Industry Co., Taiwan Branch for 15 years
• SEMI Taiwan Package and Testing Committee
   
Biography:  
Since Senju Metal Taiwan Branch was established on Nov. 1999, Lewis Huang was the first one employee. Now he has served at Senju Metal over 15 years. During this period, he totally participated the Tin-Lead transform to lead free generation.

Senju Metal as a owner who hold the lead free alloy patent, a leader company of solder joint and has the greatest technology on semiconductor package assembly, provided the total solution for lead free solder joint and cutting-edge fine pitch bumping formation technology. He also learnt lots of technique skills with Senju and customers.

Face the needs and trend of fine pitch and 3D IC package in the future, he intends to combine Senju Metal fine pitch bump formation R&D team with customers, conduct the newest technology such as Micro ball, PPS (Precoated by Powder Sheet) , Micro Cu core ball, Cu column and IMS (Injection Molted Solder) etc into assembly industry of Taiwan.