SEMI Taiwan Homepage sctaiwan_logo_2015
   
   
Topic:

Building the Materials Roadmap for 2.5D and 3D Using Advanced Analytical Techniques

   
Abstract:

Materials functionality for 2.5D and 3D assembly now goes beyond the simple testing required for SMT applications, such as IPC. Semiconductor-grade fluxes are used in many different areas of semiconductor assembly – from wafer bumping fluxes that remove oxides and surface contamination from microbumps; to flip-chip fluxes that enable reliable, direct chip attach; to wafer level CSP fluxes and ball-attach flux that join solder balls to different metallizations to form strong solder joints.

In each instance, deep insight into the basic mechanisms of functionality of the flux, and how it acts to enhance solderability, has been developed using a variety of analytical techniques. The speech will describe the different techniques that have been used – from standard SEM and EDX, to SIMS and Auger – and will also discuss how knowledge of the mechanisms of flux activity and usage can drive improved materials and processes, leading to higher yield and improved reliability.