SEMI Taiwan Homepage sctaiwan_logo_2015
   
   
Topic:

Putting the pieces together in the Materials Space: Advanced Materials Solutions for 10nm and beyond

   
Abstract:

For technology nodes at 10nm and beyond, technology challenges increase because of the introduction of new materials, new device structures, and thus new processes. The challenges require IDMs (Integrated Device Manufacturers), equipment makers, and material suppliers to work together in the semiconductor ecosystem to achieve targeted performance, yield, and cost. Such close collaboration is increasingly necessary throughout the IC manufacturing process, whether in front-end, middle section, or back-end interconnects.

In this paper, we address these materials challenges and demonstrate some advanced solutions involving wet process, deposition, and doping technologies, through our work with IDMs, OEMs, and industry consortiums. In the front-end, we will highlight exemplary work on Ge surface passivation, highly selective wet etch for Ge nanowire formation, and As-containing solutions for conformal mono-layer-doping of Ge fin structures.  For interconnect applications, we will show the importance of FFW (Fluorine free tungsten) chemistry for W deposition in both 3D NAND and future node logic devices. With cobalt the main candidate for a next generation interconnect material, we will demonstrate some initial results from novel Co precursors for selective Co CVD deposition achieving more than 300:1 selectivity on Cu vs. ULK dielectrics. This selective Co deposition is applied to fill 45nm 3:1 aspect ratio vias in a bottom-up process to achieve void-free fill ifor Cu dual-damascene integration. We expect this approach to be scalable beyond the 10nm node for solving Cu-based interconnect challenges. As an alternative deposition technology for Co, we will also discuss electrolytic and electroless Co plating based fill via by Co in dual-damascene structure We will discuss the importance of surface preparation related to deposition, plating and doping related to our advanced solutions.