Developments and Trends in Front End of the Line Materials for Advanced Semiconductor Devices
As semiconductor device manufacturing processes become more complex and challenging, the role of process materials has become extremely critical to enable continued advancement of IC manufacturing technology. This presentation will address market trends and key technology drivers like FinFET, 3D-NAND, stacked DRAM, EUV, high mobility channel…. that are changing the landscape of front end of the line materials for advanced Semiconductor devices.