Kuoming Chen received the B.E. degree in mechanical engineering from the National Taiwan University of Science and Technology, Taipei, Taiwan, the M.E. degree in mechanical engineering from the National Cheng Kung University, Tainan, Taiwan, and the Ph.D. degree in power mechanical engineering from the National Tsing Hua University, Hsinchu, Taiwan. He joined United Microelectronics Corporation (UMC) in 2000. Currently, he is the director of Test and Package Engineering Service (TPES) and TSV Committee. He has been working on various advanced packaging developments. His current research interests include Cu/ultra low-k, bumping, flip-chip, copper wire bonding CPI packaging, 3D IC / 2.5D through Si interposer assembly, fine pitch bonding, wafer-level integration, and microsystem packaging. He also is the permanent member of council, IMAPS Taiwan.
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