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Dr. Kuoming Chen  / 陳國明博士
          
Director
Test and Package Engineering Division

UMC
   
Education:  
• Ph. D. Mechanical Engineering, National Tsing Hua University
   
Experiences:  
• Deputy Director, UMC
Department Manager, Package Engineering, UMC
Deputy manager, R&D, Caesar Technology Inc.
Permanent Member of Council, IMAPS Taiwan
   
Biography:  
Kuoming Chen received the B.E. degree in mechanical engineering from the National Taiwan University of Science and Technology, Taipei, Taiwan, the M.E. degree in mechanical engineering from the National Cheng Kung University, Tainan, Taiwan, and the Ph.D. degree in power mechanical engineering from the National Tsing Hua University, Hsinchu, Taiwan. He joined United Microelectronics Corporation (UMC) in 2000. Currently, he is the director of Test and Package Engineering Service (TPES) and TSV Committee. He has been working on various advanced packaging developments. His current research interests include Cu/ultra low-k, bumping, flip-chip, copper wire bonding CPI packaging, 3D IC / 2.5D through Si interposer assembly, fine pitch bonding, wafer-level integration, and microsystem packaging. He also is the permanent member of council, IMAPS Taiwan.