• Director of package technology division, ITRI
• M.S. degree and Ph.D. in Chemistry from National Taiwan University, Taiwan
• Wharton school AMP 2010, US
• Executive Secretary of 3DIC consortium(Ad-STAC)
• Program Committee Chair of International Microsystems, Packaging, Assembly and Circuits Conference(IMPACT conference 2009)
• Chair of Advanced Microsystem and Packaging Alliance, the largest package alliance in Taiwan (AMPA)
• holds 8 patents and has published over 20 papers
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