


	Mr. Albert Ou / 歐英德 Senior Technical Manager Group R&D ASE

Education:
• MS, Chemical Engineering (Polymer Science) Feng-Chia University, Taichung, Taiwan

Experiences:
• Senior Manager, WL-SiP Dept., ASE. • Dept. Manager, 3D WLP Dept., ASE. • Over 70 patents certified in US, TW, and CN.

Biography:
Albert Ou is now leading the team of the WL-SiP Technology in ASE, dedicating on future package miniaturization through combining TSV, Wafer Process, and Packaging techniques. He started in 2010 the development of TSV Last and TSV middle, and extend the activity to corresponding process and material. In the mean time, developed in parallel the Chip-to-Wafer assembly and extend the packaging techniques to wafer level. During this period, his team commercialized world smallest accelerometer and environmental sensor of the industry. Prior to above, he also lead the development of Embedded Passive/Active technology on baseband processor product and substrate development for advance packaging. Over 70 patents were certified in different countries along his path on research and development.