• Chief Technology Officer , Yole Developpement
• Sr. Director of Applications (Memory) & Operations, SPG, Lam Research
• Director – Advanced Packaging Pathfinding, SSG CTO Office, Applied Materials
• Global Director of 3D Interconnect, Technology Integration and Transfer, Semitool
• Director of Technology R&D, Maxim IC
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• Rozalia has 24 years of experience across various industries, from industrial to electronics and semiconductors. For more than 17 years, she was involved in the research, application and strategic marketing of Advanced Packaging and 3D Interconnect, with global leading responsibilities at specialty materials (Rohm and Haas Electronic Materials), equipment (Semitool, Applied Materials, Lam Research), and device manufacturing (Maxim IC). In 2013 she joined Yole Developpement to lead and further grow the Advanced Packaging and Semiconductor Manufacturing activities.
• Rozalia is an international award winning scientist, with over 75 publications and presentations (including 3 book chapters focused on 3D IC technologies), several keynotes and panel participations.
• Throughout her career, Rozalia has been very actively supporting various industry activities and committees worldwide:
─ 2016 General Chair IMAPS Device Packaging Conference
─ 2016 Chair ECTC Advanced Packaging Committee
─ 2016 Executive Committee Member ESTC
─ 2014 General Chair Global Semiconductor and Electronics Forum
─ 2008-2011 Program Director of EMC3D Consortia
─ Chair of several 3D Committees and activities (ITRS, ECTC, IMAPS DPC)
─ Member of SRC IPC, CPMT, IWLPC, EMPC, EPTC, 3DIC committees
─ Technology Advisory Board Member at SRC IPC
• Rozalia Beica’s research, academic and industry activities resulted in winning several awards, including:
─ 2013 – Entrepreneurship Project of the Year – IE Business School
─ 2013 - #1 Entrepreneurship Project, International IE Venture Day Fudan University Shanghai, China
─ 2011 - Applied Achievement Award for Technical and Customer Excellence
─ 2010 - Applied Materials President’s Quality Award Honorable Mention for TSV Team
─ 2006 – International R&D 100 Award for Development of SnAgCu Electroplating Process for wafer bumping
─ 2002 - Dale Carnegie, “The Highest Achievement Award”
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