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Ms. Rozalia Beica

Chief Technology Officer

Yole Developpement
   
Education:  
• Global Executive MBA
─ IE Business School (Spain), Brown University (USA), Insper University (Brazil), Fudan University (China)
M. Sc. In Management of Technology
Kennedy Western University, USA
M. Sc in Chemical Engineering
Polytechnic University “Traian Vuia”, Romania
   
Experiences:  
• Chief Technology Officer , Yole Developpement
Sr. Director of Applications (Memory) & Operations, SPG, Lam Research
Director – Advanced Packaging Pathfinding, SSG CTO Office, Applied Materials
Global Director of 3D Interconnect, Technology Integration and Transfer, Semitool
Director of Technology R&D, Maxim IC
   
Biography:  
Rozalia has 24 years of experience across various industries, from industrial to electronics and semiconductors. For more than 17 years, she was involved in the research, application and strategic marketing of Advanced Packaging and 3D Interconnect, with global leading responsibilities at specialty materials (Rohm and Haas Electronic Materials), equipment (Semitool, Applied Materials, Lam Research), and device manufacturing (Maxim IC). In 2013 she joined Yole Developpement to lead and further grow the Advanced Packaging and Semiconductor Manufacturing activities.

Rozalia is an international award winning scientist, with over 75 publications and presentations (including 3 book chapters focused on 3D IC technologies), several keynotes and panel participations.

Throughout her career, Rozalia has been very actively supporting various industry activities and committees worldwide:
2016 General Chair IMAPS Device Packaging Conference
2016 Chair ECTC Advanced Packaging Committee
2016 Executive Committee Member ESTC
2014 General Chair Global Semiconductor and Electronics Forum
2008-2011 Program Director of EMC3D Consortia
Chair of several 3D Committees and activities (ITRS, ECTC, IMAPS DPC)
Member of SRC IPC, CPMT, IWLPC, EMPC, EPTC, 3DIC committees
Technology Advisory Board Member at SRC IPC

Rozalia Beica’s research, academic and industry activities resulted in winning several awards, including:
2013 – Entrepreneurship Project of the Year – IE Business School
2013 - #1 Entrepreneurship Project, International IE Venture Day Fudan University Shanghai, China
2011 - Applied Achievement Award for Technical and Customer Excellence
2010 - Applied Materials President’s Quality Award Honorable Mention for TSV Team
2006 – International R&D 100 Award for Development of SnAgCu Electroplating Process for wafer bumping
2002 - Dale Carnegie, “The Highest Achievement Award”