SEMI Taiwan Homepage sctaiwan_logo_2015
   
   
Topic:
3D-IC Designs for Power, Performance, and Cost
   
Abstract:
The talk will first cover different 3D-IC integration technologies suited for high performance, or low cost applications. It then focuses on the lower power as the common advantage of these various technologies, and how it low cost integration will enable the adoption in consumer segments. The speakers will also give some examples on challenges and solutions in implementing these designs, from Monolithic 3D to WLP fan-out.