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Mr. Brandon Wang 
         
Group Director
Digital and Signoff Group

Cadence Design Systems
   
Education:  
• MBA, University of Pennsylvania, USA
MSEE, New Jersey Institute of Technology
   
Experiences:  
• Prior to Cadence, Brandon spent over 6 years at ARM, managing  the Interface IP Group, while also serving as a member of the Corporate Patent Review Committee, responsible for low power and high speed circuits. Before that, Brandon managed an engineering group at UBICOM, now part of Qualcomm. Brandon holds 6 US patents, and has published at a number of IEEE conferences/journal papers. He also serves as a board director for CASPA, a global Chinese semiconductor organization.