


	Mr. DongSu Ryu Director Amkor Technology Korea R&D

Education:
• Bachelor of Electronic Engineering in Hanyang University, Korea • Bachelor of Business Administration in Korea National Open University, Korea

Experiences:
• Sr. Researcher, Product Development Division, Amkor Technology Korea • Sr. Researcher, PLM TFT, Amkor Technology Korea • Researcher, Design & Analysis Division, Amkor Technology Korea

Biography:
DongSu Ryu is currently as Director of Technology Development Team at Amkor Technology Korea. He has been Sr. Researcher of Amkor Technology Korea since 2000. At Amkor Technology Korea, he has showed technology leadership to success in implementing TCNCP(Thermo-Compression W/ Non-Conductive Paste) as well assembly technology into fine pitch flip chip package. These experiences have fanned out to development of ‘Laser Assisted Bond’ which is a new and advanced interconnection technology for ‘High reliability’, ‘High performance’ and ‘High productivity’. Mr. Ryu has owned several US patents on electronic packaging and activities in World Wide electronic packaging forum, including ─ Co-Arthur, Development of Fine Pitch Cu Pillar for Large 28nm Die Die in Large Organic FC Package, ECTC 2014. ─ Co-Arthur, Fine Pitch micro-bump Cu-pillar and BOT using TCNCP in IPC APEX 2014. ─ Co-Arthur, Development of Large Die Fine Pitch Flip Chip BGA Using TCNCP Technology, IEEE 2012