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Dr. ChoonHeung Lee
Executive Vice President Head of World Wide Operations & CTO Amkor Technology, Inc. |
| Education: | |
| • Ph.D. in Theoretical Solid State Physics, Case Western Reserve Univ. Cleveland, OH |
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| Experiences: | |
| • President, Amkor Technology Korea, Inc. • CTO, Amkor Technology, Inc. |
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| Biography: | |
| Broad spectrum of packaging experience for 20 years in Amkor Technology, covering lead frame/laminate design, advanced packaging development including laminate/tape/wafer level based process, materials and package configurations. Fundatmental technology understanding and organization building, powerful project management, excellent market understanding & customer relationship and WW Corporate Procurement & Business Unit management. Set-up the first Board Level Reliability Lab in Amkor, the first printing Bumping Technology/WLCSP(UltraCSP) at K4, the first Cu Pillar Bumping and ThermoCompression process at K4. Development of new products, etCSP(0.5mm max), Thermally Enhanced PBGA, flexBGA, uBGA, stack CSP, MCM PBGA, LTCC, MMC(Multimedia Memory Card), Package on Package, fcMLF, fcCSP, Super FC, and Carmera Module, TSV, Silicon Photonics, Panel Level Package. Head of Buniness Unit and Technology for 1.5 years at Chandler. |
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