SEMI Taiwan Homepage sctaiwan_logo_2015
   
   
Topic:
High Vacuum Bonding for High Performance Sensors for IOX
   
Abstract:
Wafer level bonding is an enabling technology for cost effective MEMS devices and will continue to be in the future.  The performance requirements for the wafer to wafer bonding processes continue to rise.  These requirements include reduction in wafer area consumed by the sealing ring, reductions in process temperature, increases in throughput, improved alignment, electrically conductive vias for integration of CMOS and MEMS, improvements in hermeticity, as well as increased cavity vacuum levels post bond.  When these forces are combined with the growth in MEMS for the Internet of Things the wafer bonding performance requirements will continue to increase.  Post bond cavity vacuum is important for important for gyroscopes as it effects the power consumed by the device and low power consumption will be critical for battery powered devices that will predominate in the IOT.  Also, IR (infrared) detectors such as microbolometers require high vacuum levels for optimum performance.  In this presentation the basics of vacuum encapsulation by wafer bonding will be reviewed and then recent advances in high vacuum wafer bonding will be presented.  These advances will enable a new generation of high performance sensors.