SEMI Taiwan Homepage sctaiwan_logo_2015
   
   
Topic:
Removing the Last Road Block of Deploying ILT into 10nm Node by Model-based Mask Data Preparation and Overlapped Shots
   
Abstract:
At the most advanced technology nodes, such as 20nm, 16nm, and beyond, aggressive OPC and Sub-Resolution Assist Features (SRAFs) on the mask are essential for accurate on-wafer imaging; mask patterns generated by Inverse Lithography Technology (ILT) and Source Mask Optimization (SMO) may also be necessary for production. However, their use results in significantly increased mask complexity, making mask writing more challenging than ever, particularly in terms of write time and mask pattern fidelity.

Such challenge will be solved by multi-beam mask writer when it is ready, and can be solved by deploying Model Based -Mask Data Preparation (MB-MDP) with overlapped shots on the current VSB mask writer. In this paper we are going to present the latest results of this MB-MDP product based on Graphic Process Unit (GPU).

Keywords—Inverse Lithography Technology (ILT); mask writing, Mask Data Preparation (MDP); Model-Based Mask Data Preparation (MB-MDP); GPU, General Purpose GPU (GPGPU); overlapped shots; Variable Shaped Beam (VSB), mask write