Dr. Hsin-Hsin Hsieh / 謝心心      

Senior Researcher / 資深研究員

Center for Measurement Standards, ITRI / 工業技術研究院

• Senior Researcher, Project Leader in ITRI, 2013-

• Researcher, Project Leader in ITRI, 2007-2013

• Received PhD in Materials Engineering in 2007

• More than 50 publications, 5 patents

• Peer reviewer in SCI journal

Research Field:

Developing methodologies of solar devices R&D on innovative the solar materials and technologies


Abstract:

Solder materials and technology have been used in a variety of applications to semiconductor package assembly and electronics industry for more than 50 years due to their good electronic conductivity and low processing temperature. In photovoltaics (PV), the soldering of Sn-coated interconnection on individual cells is also a critical step in the module assembly process. During the soldering process, the solder on the PV ribbon melts and reacts with the sintered metallization layer of the solar cell at the reaction temperature, and several intermetallic compounds are formed within the solder joint because of the interfacial reactions between Cu/solder and solder/Ag interface. In this research, the evaluation of commercial PV interconnections (including two lead SnAgPb and SnPb solders, and a lead-free SnAgCu solder) on sintered Ag metallization layer are proposed. And the interfacial reactions and growth kinetics of intermetallic compounds at the solder/sintered Ag metallization interface in silicon solar cells were investigated during solid-state aging. 

These kinetics data were established for the first time for the solder alloys commonly used in PV module assembly industry.