SEMI Taiwan Homepage sctaiwan_logo_2015
   
   
Topic:
EUV Lithography Insertion
   
Abstract:
This paper summarizes the progress of insertion of EUV lithography in high-volume manufacturing (HVM) at customers. Key prerequisites are: (1) Imaging, overlay, and defectivity in specification (2) Wafers per day (WPD) meeting target (3) The availability of an industrial EUV Pellicle solution.

The first 0.33-NA NXE:3300B system has shown imaging, overlay and defectivity performance in line with insertion at the targeted customer nodes. System extensions are planned to further tighten its specifications, to be standard in its successor, the NXE:3350B, of which the first will be shipped in 2015.

For WPD, good source performance is essential, and key items include: (1) power (2) availability (3) dose control.

In cooperation with suppliers and users, ASML is taking the lead in making available a fully integrated EUV pellicle solution including: (1) pellicle films and a supply chain therefor, (2) pellicle frames, (3) pellicle mounting, dismounting and remounting tools (3) reticle pods compatible with pellicle, (4) scanners being compatible with pelliclized reticle usage. We will present an update on the status of EUV pellicle industrialization.