Topic:
Wafer Level Fan-out and Embedded Technology for Potable/ Wearable/ IOT Devices
Abstract:
Potable/ Wearable/ IOT devices are a hot topic these days, and will be the main driver of economic growth in the next years. This increasing demand, in turn, is driving the core capabilities – Sensing, Connectivity, SMART Potable and Networking as its essential ecosystem with the trends on small form factor, thin package profile as well as 3D integration of IC devices.                                                                            Wafer Level Fan-out as a platform of embedded technology is considered an alternative solution to achieve high level integration with multi-functionalities, form factor shrinkage, lower Z height (substrate-less) and high performance advantages. Also, another technology would be the embedded die substrate (EDS) which providing the benefits on high integration of parts to enable the PKG size miniaturization.                                                   Various Fan-out structures and technologies have been developed for allowing 2D Multi-die and large-die capability in Networking solution and 3D PoP (Package-on-Package) with double side integration which help numerous active or passive components embedded inside in Potable driven applications of Wearable/IoT products.                                                          In addition, by applying the embedded die substrate (EDS), will offer a completed embedded solution with design flexibility to target at low pin count products such as PMIC, Sensing as well as Connectivity for substrate area and thickness shrinkage.                                                                         Wafer Level Fan-out and Embedded Die Substrate (EDS) are definitely the current front-runner for Potable/ Wearable/ IoT applications as its packaging integrators that will enable such system integration, and key solution providers will tend to use advanced package technology to reduce size, power consumption and provide total solution for customer fast design-in to market.