SEMI Taiwan Homepage sctaiwan_logo_2015
   
   
Topic:
Innovative Substrate Technologies in the Era of IoT
   
Abstract:
The society is moving to the era of IoTs. Everything is smartly connected to provide a better quality of life for human being.

Semiconductor technology moves from 16 nm to 10 nm and under; the demand for fine pitch interconnection substrate is inevitable. It is very difficult for current laminated substrate technology to meet the fine line requirement. Hence, alternative fine line substrate solutions are needed.

In this talk, the substrate solution to reach fine line ( 2 µm) in panel size (508x508 mm) will be discussed. Alternative substrate material such as “glass” to replace laminated core materials will also be discussed.

In addition, innovative substrate structures that eliminate the “cores” and “solder joints” will be proposed. Innovative substrate structures such as embedded interposer carrier (EIC) and embedded High Density film (e-HDF) will be proposed and evaluated.