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Dr. Dyi Chung Hu

Senior Executive Advisor
CEO Office

Unimicron
   
Education:  
• Ph. D. in Material Science and Engineering Department, Massachusetts Institute of Technology, USA
   
Experiences:  
• Senior Vice President, RD and New Business Development, Unimicron
Co-founder, PVI and HSD Display
IBM / East Fishkill, Electronic Packaging Development
Associate Professor, National Chiao Tung University
   
Biography:  
Dr. Dyi-Chung Hu earned Ph. D. degree from MIT in Material Science and Engineering Department in 1984. He has extensive experience in semiconductor packaging, TFT LCD display and IC substrate development. He has over 100 patents in above fields. He holds various engineer and management positions. He is also cofounder of two TFTLCD display companies in Taiwan. Currently he is a Senior Executive Advisor for next generation substrate development in Unimicron. He is also the CEO of SiPlus co., targeting  advance packaging platform development.