IC Design Summit  |
In addition to Internet of Things (IoT), the Internet of Vehicles (IoV) and other automotive applications will be the next drive of semiconductor market. According to a recent research by IHS, the value of automotive semiconductor market will continue to grow to US$31 billion this year, with a 7.5% increase from last year. The major contributions are facial/fingerprint recognition systems, quick and wireless charging, panorama photography, collision avoidance systems, integrated security systems and autopilot, which require various types of ICs and are expected to bring prosperity to automotive semiconductors in the years to come.
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Date: September 4, 2015 (Friday)
Time: 08:30-12:20
Venue: Room 638, Nangang Exhibition Center, Hall 1
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Theme: Trends & Challenges in Today's Automotive
Semiconductors
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The influence of automobile electronics is rapidly growing and the new chips in the automotive industry keep growing both in functionality and numbers. Increased demand was led by an increase in power semiconductors used in powertrain, infotainment and advanced driver assistance systems (ADAS) applications in automotive applications. Electronics and design automation will play a critical role in shaping the future of automotive by providing design technology that develops high-reliability and safety-critical system.
This year in IC Design Summit, featuring the trend and challenges in today’s automotive semiconductor,speakers from UMC, Broadcom, Imagination, Mentor, NXP, Synopsys and other key players in the industry will share their insights of how IC design plays a critical role in shaping the future of automotive by providing technology for high-reliability and safety-critical system.
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Forum Moderator:
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Lung Chu
Corp VP, Corp PM Officem, GUC
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Chairman of CASPA Taiwan
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Speakers:
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Volker H. Politz
VP Segment Marketing
Imagination |
Kurt Huang
Director, Corporate Marketing
UMC |
Robert Li
Country Manager of Taiwan
Synopsys |
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Russell Lee
PacRim Technical Director
Mentor Graphics |
Mark Chen
Taiwan Country Manager
Broadcom |
Waidy Chan
Sr. Director of Greater China Automotive Business
NXP |
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Forum Agenda:
| Time |
Topic |
| 08:30-09:00 |
Registration |
| 09:00-09:10 |
Welcome Remarks |
| 09:10-09:35 |
Security for Connected Cars |
| 09:35-10:00 |
Foundry's Role in the Accelerating Automotive
Supply Chain |
| 10:00-10:25 |
Silicon to Software - Shift Left, Left & Left |
| 10:25-10:35 |
Break |
| 10:35-11:00 |
Achieving IC Reliability for Internet of
Vehicles Application |
| 11:00-11:25 |
Semiconductor Innovation for Internet of
Vehicles |
| 11:25-11:50 |
Connected Cars |
| 11:50-12:20 |
Panel Discussion: Trends and Challenges in
Today's Automotive Semiconductors |
| 12:20-13:30 |
IC Design Industry Luncheon
(By Invitation Only)
Time: 12:00-13:30 (Registration at 11:40)
Venue: Nangang Exhibition Center, Hall 1
For Luncheon info, please contact:
Ms. Cindy Chan
8868-3-560-1777#305
cchan@semi.org
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