(1) Non-Standard Products – there is no standard product or application can dominate IoT/wearable device market. In this market, most of the customers need highly integration solutions, such as multi-functional SiP module, for variants of application/products.
(2) Variants of customer types- in IoT/Wearable market, customers are in all different kind of industry, such as Consumer, Generic Business, Automotive, Agriculture, Education, Healthcare and Government, etc. Also, customers are in different types, most of them are Start-up companies. These IoT/Wearable customers don’t have much resource or experience on complicated system design; this needs solution providers to support.
(3) Size, Cost and Time to Market Sensitive. In IoT/Wearable market, customers cares more on Size, Cost, Power and especially “time to market”. Key solution providers will tend to use advanced package technology to reduce size, power consumption and provide total solution for customer fast design-in to market.
To provide higher integration solutions, modulize is a trend and SiP plays more important role in this high matrix market. OSAT SiP solutions for this market:
- Total Solution Supporting from Wafer Bumping to Module Assembly
- System Design and Testing Capability
- Miniaturization Technology Includeing
1) EMI Shielding on Package
2) Solutions for Active Die and Passives Integration
3) Antenna in Package