Topic:
SMT Solder Paste Printing For Fine-pitch
Abstract:
Demand for miniaturization, high-functionality, and light-weight devices is driving electronic components toward fine-pitch, high-density assemblies. To achieve greater accuracy in SMT (surface mount technology) for fine-pitch interconnects, it is imperative to select the most suitable solder paste in addition to advanced process controls. This paper presents a study on the factors that influence fine-pitch solder paste and stencil selection, as well as optimum settings for the screen-printing and reflow process.