Topic:
Where is the Packaging Technology drifting?
Abstract:
The mobile technology has been a driving force for the semiconductor market. Seeing the saturation of high end smartphone market and emergence of Internet of Things (IoT), the industry is experiencing the situation in the two sides of the coin: cost and performance. Especially IoT is getting the name of ‘the center of gravity’ for next generation driver of the semiconductor industry, which is very broad in applications, meaning it can be dominantly of low volume and high mix type, which requires ‘speed’ and ‘flexibility’.                                                            In this talk packaging technologies with speedy and flexible manner will be shared. Also emerging technologies in conjunction with 2.5D/3D wafer processing will be discussed.