SEMI Taiwan Homepage sctaiwan_logo_2015
   
   
Topic:
Miniaturizing IC Package Technologies
   
Abstract:
An immediate comprehension of “miniaturization” is about a technology/process to reduce devices/parts size and weight.  If we extend the absolute size point of view to a relative point of view, “miniaturization” is a process to integrate more components into a given size/area such that a device can be equipped with more functions. This is part of the spirit of Moors’ law. With the growth of IoT, sophisticated algorithm for cloud computing and big data, current electronic devices are getting smarter and yet remain manageable or even smaller in size. Today’s devices not only process data/information passively; also actively sense environment (mechanically, optically, and chemically), analyze data, generate information and take actions. In this presentation, ASECL provides package miniaturization solutions  and shares progresses to integrate heterogeneous components in a package to meet requirement for today’s devices, and pave the path for tomorrow’s needs.