Dr. Tanja Braun
Fan-out Wafer and Panel Level
Packaging program at Fraunhofer IZM
Fan-out Wafer and Panel Level
Packaging program at Fraunhofer IZM
• Since 2000 she is working with the group Assembly & Encapsulation Technologies and since 2012 she is deputy head of this group.
• Her field of work is process development of assembly and encapsulation processes. Recent research is focused on reliable sensor packaging for automotive, industrial and bio-medical application as well as on wafer and panel level mold embedding technologies.
• In 2013 she received her Dr. degree from the Technical University of Berlin for the work focusing on humidity diffusion through particle-filled epoxy resins.
• Results of her research concerning packaging for advanced packages have been presented at multiple international conferences.
• In 2014 she received the Fraunhofer IZM research award.
• She is responsible for Fan-out Wafer and Panel Level Packaging program at IZM