Douglas Yu / 余振華博士
Senior Director
Integrated Interconnect and
Packaging Technology, TSMC R&D
Senior Director
Integrated Interconnect and
Packaging Technology, TSMC R&D
• Director, Advanced Shrink Technology, TSMC R&D
• Semiconductor Technology R&D, AT&T Bell Labs
• Innovate, develop and deliver TSMC WLSI Technologies for wide range of device- and system-integrations.
• Pioneer and deliver Industry’s 1st 3D-IC to production using innovative CoWoSTM for homogeneous and heterogeneous system-integrations from 28nm node.
• Deliver Industry’s 1st Cu/Low-K technologies to production from 0.13mm node on with the best performance and power. Set industry high standard of on-chip interconnections.
• Pioneer and deliver Foundry’s 1st Cu/FSG to production. Develop leadership multilayer high-density Al/USG & FSG.
• Published numerous technical papers and 2 book chapters.
• Granted more than 450 issued US Patents.
Dr. Yu’s outstanding R&D accomplishments have won many recognitions, including:
─ 2013 National Industry Innovation and Navigation Award, MOEA
─ 2012 IEEE Fellow
─ 3 times TSMC Chairman (Dr. Morris Chang) Award winner.
─ 2009 Best Engineer Award, CIE.
─ 2006 National R&D Manager Excellence Award, CPMA.
─ 2006 TSMC Innovation and Customer Partnership Awards
─ 2004 Industrial Technology Advancement Award, MOEA
─ 2003 Outstanding Science and Technology Award, National Science Council, The Executive Yuan, Taiwan
─ 2001 National Invention Award, MOEA