Shipments of wafer level packages (WLPs) continue to increase, driven by mobile products. The CAGR for fan-in WLPs in units from 2014 to 2019 is almost 9% for the five-year period, while the CAGR in wafers is 10%. This popular package has enabled the introduction of thin products. Many versions of the WLP continue to be introduced, including fan-out WLP (FO-WLP). Several companies plan to adopt FO-WLPs for PMIC, RF, and application processors, as well as controllers, media chips, and sensors. Some companies are investigating FO-WLP as a system-in-package solution. This presentation discusses the various formats of WLP including FO-WLP. The infrastructure for both fan-in and FO-WLP are discussed. Advantages and challenges with new technologies such as panel FO-WLP are discussed and a comparison to alternative packages is presented.
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