• Ph.D., Electrical Engineering, Stanford University, USA
Experiences:
• Chairman of Taiwan Semiconductor Association (TSIA) since 2013 • Board Director and Asia-Pacific Leadership Council Chairman of the Global Semiconductor Alliance (GSA) and was the Board Chairman of GSA from 2009-2011 • Recipient of Taiwan’s National Medal of Excellent in Science & Technology • Member, US National Academy of Engineering; IEEE Fellows in 1991; IEEE 1998 Solid State Circuits Award Recipient • Inventor of the 3D Trench DRAM cell & Designer of the World’s Fastest DRAM in IBM Research (Receiving of IBM Corporate Award)