Mr. Fei-Jain Wu is the Chairman of Chipbond Technology Corporation, the largest Gold Bumping service provider worldwide.

Mr. Wu co-founded Chipbond in 1997 and brought the company listed on the Over-The –Counter Stock Exchange in Taiwan in January 2002.

Prior to establishing Chipbond, Mr. Wu co-founded a semiconductor equipment company, MRSI, in the United States and worked there for 10 years.

He published over 150 technical and market survey papers in various conferences; and, was the Chairman of SEMI Taiwan Packaging and Testing Committee.




	Mr. Fei-Jain Wu / 吳非艱先生 Chairman, Chipbond Technology Corporation SEMI Taiwan PKG&TEST Committee , Member

Profile Mr. Fei-Jain Wu is the Chairman of Chipbond Technology Corporation, the largest Gold Bumping service provider worldwide. Mr. Wu co-founded Chipbond in 1997 and brought the company listed on the Over-The –Counter Stock Exchange in Taiwan in January 2002. Prior to establishing Chipbond, Mr. Wu co-founded a semiconductor equipment company, MRSI, in the United States and worked there for 10 years. He published over 150 technical and market survey papers in various conferences; and, was the Chairman of SEMI Taiwan Packaging and Testing Committee.