Education:
Master of industrial & mechanical engineering department, Univ. of Wisconsin, Madison.
Experience:
Over 20 years of job experience on semiconductor industry, especially focus on bumping and flip chip advanced assembly technology.
Vice Chairman of Semiconductor Equipment and Materials International Taiwan Association.
Chairman of TILA (Taiwan Intelligent Leader Association).
Now:
Senior Director of Engineering Center of SPIL (Siliconware, Taiwan), which is 3rd biggest assembly house in the world now.
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