Currently, Dr. Tong is President of Cyntec, a Member of Delta Electronics Group. Dr. Tong is a board member of SEMI, and is an Advisory Committee Member of National Chip Implementation Center, National Applied Research Laboratories, Republic of China. Prior to joining Delta Electronics, Dr. Tong had been with ASE Group for 14 years and served as the Chief R&D Officer of the ASE Group. He was also on the board of ASE Test. Dr. Tong started, as Executive VP, the Formosa Advanced Technologies Corporation which is today a leading memory IC packaging and test service provider. Dr. Tong served 14 years at IBM as Research Staff Member at Thomas J. Watson Research Center and as Senior Engineering Manager at IBM’s East Fishkill Facility, responsible for leading-edge IC and IC package developments covering C4 plating and the plated copper wiring IC technology, both of which have become world standards.

Dr. Tong was elected IEEE Fellow for leadership in leading-edge integrated circuits technology for his world-standard-setting contributions in integrated circuits and advanced packaging and test covering package, module and system. He was also elected Fellow of the Chinese Society for Management of Technology. Dr. Tong received his Ph.D., M.S. & M. Ph. degrees from Columbia University, and his B.S. degree from National Taiwan University, all in engineering. He has authored/co-authored 112 patents, 100+ technical publications, as well as 2 books and 2 special journal issues on electronic packaging.




	Dr. Ho-Ming Tong / 唐和明博士 President / Cyntec Co., Ltd. Honorary Chairman, SEMI Taiwan PKG&TEST Committee

Profile

Currently, Dr. Tong is President of Cyntec, a Member of Delta Electronics Group. Dr. Tong is a board member of SEMI, and is an Advisory Committee Member of National Chip Implementation Center, National Applied Research Laboratories, Republic of China. Prior to joining Delta Electronics, Dr. Tong had been with ASE Group for 14 years and served as the Chief R&D Officer of the ASE Group. He was also on the board of ASE Test. Dr. Tong started, as Executive VP, the Formosa Advanced Technologies Corporation which is today a leading memory IC packaging and test service provider. Dr. Tong served 14 years at IBM as Research Staff Member at Thomas J. Watson Research Center and as Senior Engineering Manager at IBM’s East Fishkill Facility, responsible for leading-edge IC and IC package developments covering C4 plating and the plated copper wiring IC technology, both of which have become world standards. Dr. Tong was elected IEEE Fellow for leadership in leading-edge integrated circuits technology for his world-standard-setting contributions in integrated circuits and advanced packaging and test covering package, module and system. He was also elected Fellow of the Chinese Society for Management of Technology. Dr. Tong received his Ph.D., M.S. & M. Ph. degrees from Columbia University, and his B.S. degree from National Taiwan University, all in engineering. He has authored/co-authored 112 patents, 100+ technical publications, as well as 2 books and 2 special journal issues on electronic packaging.