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Ms. Rozalia Beica

Chief Technology Office

Yole Development

Education :
Global Executive MBA, IE Business School (Spain) / Brown University (USA) /

   Insper University (Brazil) / Fudan University (China)

M. Sc in Chemical Engineering, Polytechnic University “Traian Vuia”, Romania

M. Sc. In Management of Technology, Kennedy Western University, USA



Experiences :

Chief Technology Officer , Yole Developpement

Sr. Director of Applications & Operations, Spin Clean Product Group, Lam Research

Director – Advanced Packaging Pathfinding SSG CTO Office, Applied Materials

Global Director of 3D Interconnect, Technology Integration and Transfer, Semitool

Director of Technology R&D, Maxim IC


 Biography :
Rozalia Beica is currently the CTO of Yole Developpement leading Advanced
Packaging Business Unit and Semiconductor Manufacturing activities within Yole

Rozalia is an international award winning scientist with over 60 publications and
several patents. For more than 16 years, Rozalia has been involved in the
research, application and strategic marketing of Advanced Packaging and 3D IC
technologies, with global leading responsibilities at materials (Rohm and Haas),
equipment (Semitool, Applied Materials, Lam Research) and device
manufacturing (Maxim IC) organizations.

She is actively involved in industry events and committees worldwide:

General Chair elect at 2015 IMAPS Device Packaging Conference (DPC)
Co-Chair of 2015 ECTC Advanced Packaging Committee
General Chair of 2014 Semiconductor Global Forum
Chair of 3D and Packaging Committee 2012-2014 IMAPS DPC
Chair 3D activities across all committees for 2012 ECTC
Technology Advisory Board Member at SRC Interconnect & Packaging
Committee (2011)
Member of ITRS, IWLPC, EMPC Advanced Packaging committees


Rozalia Beica’s research, academic and industry activities resulted in winning
several awards, including:

2013 – Entrepreneurship Project of the Year – IE Business School
2013 #1 Entrepreneurship Project, International IE Venture Day Fudan 
        University Shanghai, China
2011 Applied Achievement Award for Technical and Customer Excellence
2010 Applied Materials President’s Quality Award Honorable Mention for
        TSV Team
2006 – International R&D 100 Award for Development of SnAgCu
        Electroplating Process for wafer bumping
2002 Dale Carnegie, “The Highest Achievement Award”