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Mr. Lewis Huang / 黃智堯

Deputy General Manager

Senju Metal Industry Co., Ltd Taiwan Branch

Education :




Experiences :

 Senju Metal Industry Co., Taiwan Branch for 15 years

SEMI Taiwan Package and Testing Committee

 Biography :
Since Senju Metal Taiwan Branch was established on Nov. 1999, Lewis Huang
was the first one employee. Now he has served at Senju Metal over 15 years.
During this period, he totally participated the Tin-Lead transform to lead free

Senju Metal as a owner who hold the lead free alloy patent, a leader company of
solder joint and has the greatest technology on semiconductor package
assembly, provided the total solution for lead free solder joint and cutting-edge
fine pitch bumping formation technology. He also learnt lots of technique skills
with Senju and customers.

Face the needs and trend of fine pitch and 3D IC package in the future, he
intends to combine Senju Metal fine pitch bump formation R&D team with
customers, conduct the newest technology such as Micro ball, PPS (Precoated by
Powder Sheet) , Micro Cu core ball, Cu column and IMS (Injection Molted Solder)
etc into assembly industry of Taiwan.