Mr. David Wu
Regional Product manager, RAPID
KLA-Tencor
Education:
Master, NTU mechanical engineering
Experience:
KT RAPID APPS
KT RAPID regional product manager
Abstract:
Advanced Mask Inspection Technologies for 22-nm and Beyond
Latest industry opinion is that the insertion of extreme ultraviolet lithography (EUVL) into high volume manufacturing (HVM) in the 2015 – 17 timeframe at the 16-nm HP node. Every year the industry assesses the key risk factors for introducing EUVL into HVM, and mask inspection, defects, and mask
quality are some of the top risk factors. KLA-Tencor (K-T) has been working on mask inspection using a 193-nm-based inspection system, focusing on three use cases: EUV Blank Inspection, Mask Pattern Inspection including both Die-to-Die and Die-to-Database inspection, and Fab Requalification inspection.
In this paper, we report on the latest data and results of this work. Included in this paper are the first results from the next-generation inspection system, which has been in pilot production at a customer site for several months. We will also discuss the latest simulation results which suggest that this platform can
be extended beyond the initial 22-nm HP target, to at least 18-nm HP node, for EUV pattern and blank inspection and reticle requalification. Lastly, we will report the latest development status on extreme ultraviolet (EUV) actinic pattern mask and blank inspection tool.
Keywords: EUVL, Mask Inspection, Die-to-Database, Die-to-Die, EUV Blank (Phasur), EUV Actinic
Pattern Mask Inspection (APMI)