Dr. Huili Fu
Chief IC Packaging Expert, Dept Director
IC Packaging Engineering Dept
Huawei (Hisilicon)
Education:
PhD MechEng Hong Kong University of Science and Technologies.
Experience:
Chief IC packaging expert and department director of Packaging Engineering Dept, Huawei (Hisilicon ) Director of Process and Packaging Engineering , ASAT (Hong Kong) Ltd,
R&D Director and Chief Technologist at Advanced Interconnect technologies (AIT) Ltd